For many years, Teknek has led the way in contact cleaning technology, removing particles from high-value manufacturing processes, including PCB Assembly. This process is an essential part of a zero-defect strategy, not only enhancing product quality but also reducing waste and rework. In industries where zero defects and zero rework are critical, such as automotive, effective particle removal becomes even more important.

VDA and ISO Standards for Technical Cleanliness

For some time organisations have focused on the importance of cleanliness of parts and processes, most notably the German Association of the Automotive Industry (VDA). They introduced standards such as VDA 19.1 and VDA 19.2, which later became ISO 16232 in 2018. These standards provide methods for assessing Technical Cleanliness, outlining how the cleanliness of parts, assemblies, and environments can be measured.

The core of these standards involves a high-efficiency particle extraction process that captures and measures both the quantity and size distribution of particles. This extraction method is widely used as a quality control tool within the automotive supply chain, ensuring high particle collection efficiency.

Challenges in Circuit Board Cleanliness

While VDA 19 and ISO 16232 are highly effective for automotive parts, the traditional solvent wash-off process used for particle extraction is less suited for circuit boards and assemblies. As an offline testing method, it provides only a snapshot of contamination at a given point in time, with no scope for inline particle capture.

However, the ZVEI Technical Cleanliness in Electrical Engineering (2nd edition) expands on VDA 19, offering guidance on how to apply cleanliness assessments to circuit boards and assemblies. More importantly, it sets the stage for inline particle capture, which is critical for real-time contamination control in high-volume production.

Teknek: Leading the Way in Inline Particle Capture

Teknek has taken the lead in adapting to the demands of Technical Cleanliness standards. Using an approved UK-based testing facility, Teknek’s contact cleaning roller technology was rigorously tested and approved as compliant with VDA 19, demonstrating its effectiveness as a particle capture device.

Unlike other technologies, Teknek’s SMT board cleaners use the same certified particle extraction technology inline, offering constant, high-efficiency board cleaning during production. This unique advantage enables manufacturers to ensure cleanliness at the most critical stage—the start of the production line.

How Teknek Technology Works

Teknek's system first captures particles on its proprietary cleaning roller, which efficiently removes contamination from boards. The particles are then automatically transferred to a special adhesive roll, where they are permanently captured and securely removed from the process. Particles are also conveniently available for detailed optical analysis where required. This allows manufacturers to continually monitor and mitigate contamination risks inline.

Proven Particle Removal for High-Volume Production

Teknek’s solution is proven to work inline, where zero-defect production is essential. By offering a capture process compliant with VDA 19 standards, Teknek ensures that manufacturers can confidently reduce contamination risks in high-volume sectors like automotive, where technical cleanliness is non-negotiable.