For years, Teknek has played a pivotal role in advancing yields and improving performance in electronics assembly. We’ve seen significant success in the global automotive Surface Mount Technology (SMT) sector and high-end consumer electronics, including mobile phones.

 

Our innovative Tek-BC board cleaners set the standard for removing foreign object debris (FOD) from production lines, effectively eliminating metallic and non-metallic particles as small as 20 nanometer.

 

At this year’s SMTAI Conference and Expo in Rosemount, Teknek is thrilled to introduce the Tek-BC40—the latest advancement in our Tek-BC range—to the U.S. market. The Tek-BC40 takes contamination control to new heights, helping manufacturers optimize their production processes, reduce defect risks, and achieve the flawless quality required in critical industries.

 

What makes the Tek-BC range stand out is its proprietary contact cleaning technology, designed specifically to address contamination-related defects in advanced electronics production. Offering unmatched contamination removal performance, the Tek-BC cleaners operate at mission critical stages in production, ensuring low-static and low-strain cleaning to maintain the integrity of sensitive electronic components.

 

Already recognized by Tier 1 global producers, our cleaners have become essential in ensuring top-quality results. Yet, some manufacturers are still unaware of the considerable advantages that board cleaning provides at the beginning of the SMT production line. This can be due to the misconception that boards arrive “clean” from PCB producers or a lack of awareness on significance of process derived contaminants for example laser marking.

 

Visit our booth [2011] at SMTAI to discover first-hand how Teknek’s board cleaners can elevate your production performance and deliver the reliability your high-stakes applications demand.