NEPCON China is a prestigious professional trade platform and exhibition on SMT (surface mount technology) and EMA (electronics manufacturing automation). It brings together over 500 renowned brands from the electronics manufacturing industry around the globe with innovative equipment, materials, and system integration solutions covering areas such as SMT, electronics manufacturing automation, welding, dispensing, spray coating, testing and measurement.
Teknek will attend this top level professional trade show again in 2018. On 24th – 26th April 2018, at Shanghai NEPCON, booth number 1D50, you will view the brand new Teknek the most innovative product – GAR (Gold Adhesive Roll).
Teknek ‘Gold’ adhesive roll is a major breakthrough and combines many features from other Teknek adhesive products.
This new product is silicone free, sheeted, anti-static and works with all cleaning rollers types. Having one universal adhesive means choosing the right adhesive is never an issue.
Also you will experience the ‘full movement cleaning process’ of Teknek Contact Cleaning Machine and understand the core essence of our products.
Welcome to Teknek booth – Pioneer of Contact Cleaning Innovation Technology.