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Teknek has chosen Nepcon to once again launch its new product for PCB assembly – SMT2!

NEPCON ASIA will be held at the Shenzhen Convention and Exhibition Center from August 28 to August 30, 2019. The exhibition is expected to span 60,000 sqm, making it the largest NEPCON exhibition ever.


The show will be themed around 5G. The exhibition floor will feature new technologies and products from across the field of electronics manufacturing. These will include printed circuit boards, circuit board assembly machinery, automatic assembly solutions and testing devices.


SMT2 is the latest high-performance board cleaner from Teknek product, its global launch will take place at Nepcon.


SMT2 gives the same high-performance cleaning that all Teknek products provide. The new product is the first cleaner to offer full compatibility with IPC Hermes, an essential part of Smart Factory/Industry 4.0.


Want to be the first to view this new product with the most innovative technology? Visit the Teknek booth at 1B50.


Location:        Shenzhen Convention & Exhibition Center, Shenzhen, China

Date:               28th – 30th Aug. 2019